MACOM Announces Industry's First CWDM4 L-PIC For 100G Datacenter Applications

MACOM’s New MAOP-L284CN L-PIC Integrates Lasers with Silicon Photonic Integrated Circuits

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, recently announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC) for a 100G transmit solution for CWDM4 and CLR4 applications.

To meet the explosive growth of data traffic driven by video and mobile, major Internet content providers, such as Amazon, Microsoft, Google and Facebook, are building hyper-scale datacenters, which require high-speed interconnect solutions that are power efficient, compact and cost optimized. MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.

MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s. The L-PIC operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC for optimized performance and power dissipation.

“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, for MACOM.

MACOM’s L-PIC will be on display for private demonstrations at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA. To make an appointment, contact your local sales representative. For more information on MACOM’s broad optical and photonic portfolio at OFC click here (http://www.macom.com/about/news-and-events/events-archive/row-col1/news--event-archive/ofc-2016).

About MACOM
M/A-COM Technology Solutions Inc. is a leading supplier of high-performance analog RF, microwave, millimeter wave and photonic semiconductor products that enable next-generation internet and modern battlefield applications. Recognized for its broad catalog portfolio of technologies and products, MACOM serves diverse markets, including high speed optical, satellite, radar, wired and wireless networks, industrial, medical, and mobile devices. A pillar of the semiconductor industry, we thrive on more than 60 years of solving our customers' most complex problems, serving as a true partner for applications ranging from RF to Light.

Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, Asia and Australia.

MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners. For more information, visit www.macom.com.